✦ LIBER ✦

Low contact resistance of n+-Si/Ti/WNx/Al submicron contact structures

✍ Scribed by Yong Tae Kim; Chang Woo Lee

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Low-resistance Ti/Al/Ti/Au multilayer oh

✍ Wang, Dong-Feng; Shiwei, Feng; Lu, C.; Motayed, Abhishek; Jah, Muzar; Mohammad, 📂 Article 📅 2001 🏛 American Institute of Physics 🌐 English ⚖ 281 KB

Electrical and structural properties of

✍ V. Reddy; Sang-Ho Kim; Tae-Yeon Seong 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 136 KB

Low resistance Ti/Al/Au ohmic backside c

✍ Chen, Y.-A.; Cohen, D.A.; DenBaars, S.P. 📂 Article 📅 2010 🏛 The Institution of Electrical Engineers 🌐 English ⚖ 137 KB

Thermally-stable low-resistance Ti/Al/Mo

✍ Kumar, V.; Zhou, L.; Selvanathan, D.; Adesida, I. 📂 Article 📅 2002 🏛 American Institute of Physics 🌐 English ⚖ 334 KB

Temperature dependence of contact resist

✍ A. E. Belyaev; N. S. Boltovets; R. V. Konakova; Ya. Ya. Kudryk; A. V. Sachenko; 📂 Article 📅 2012 🏛 Springer 🌐 English ⚖ 242 KB

Low resistance Al/Ti/n-GaN ohmic contact

✍ Kwak, Joon Seop; Mohney, S E; Lin, Je-Yi; Kern, R S 📂 Article 📅 2000 🏛 Institute of Physics 🌐 English ⚖ 224 KB