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Loading and characterization of a printed-circuit-board atomic ion trap

โœ Scribed by Brown, Kenneth; Clark, Robert; Labaziewicz, Jaroslaw; Leibrandt, David; Chuang, Isaac; Richerme, Philip


Book ID
115530474
Publisher
The American Physical Society
Year
2007
Tongue
English
Weight
336 KB
Volume
75
Category
Article
ISSN
1050-2947

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Surface investigation of copper in the p
โœ A. Manara; V. Sirtori ๐Ÿ“‚ Article ๐Ÿ“… 1990 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 297 KB

## Abstract The aim of the study was to determine both the oxidation rate of copper in the printed circuit board and the degradation of an organic compound (ENTEK) present on its surface during the different phases of circuit assembling. A large number of samples stripped from electronic cards hav