Surface investigation of copper in the printed circuit board
β Scribed by A. Manara; V. Sirtori
- Publisher
- John Wiley and Sons
- Year
- 1990
- Tongue
- English
- Weight
- 297 KB
- Volume
- 15
- Category
- Article
- ISSN
- 0142-2421
No coin nor oath required. For personal study only.
β¦ Synopsis
Abstract
The aim of the study was to determine both the oxidation rate of copper in the printed circuit board and the degradation of an organic compound (ENTEK) present on its surface during the different phases of circuit assembling.
A large number of samples stripped from electronic cards have been measured by XPS and Auger techniques βas receivedβ in order to have a statistical indication of surface composition. Other samples were heated at 220Β°C in a vapourβphase atmosphere.
A very thin layer (βΌ20 Γ ) is present on the copper of the printed circuit board. This layer comprises carbon, oxygen and nitrogen. After vapourβphase treatment at 220Β°C, the layer on the copper surface increases up to βΌ100 Γ and its composition changes: carbon decreases, oxygen appears more in the βlattice formβ than as hydroxide and nitrogen is present in two valence states.
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