𝔖 Bobbio Scriptorium
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Surface investigation of copper in the printed circuit board

✍ Scribed by A. Manara; V. Sirtori


Publisher
John Wiley and Sons
Year
1990
Tongue
English
Weight
297 KB
Volume
15
Category
Article
ISSN
0142-2421

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✦ Synopsis


Abstract

The aim of the study was to determine both the oxidation rate of copper in the printed circuit board and the degradation of an organic compound (ENTEK) present on its surface during the different phases of circuit assembling.

A large number of samples stripped from electronic cards have been measured by XPS and Auger techniques β€˜as received’ in order to have a statistical indication of surface composition. Other samples were heated at 220Β°C in a vapour‐phase atmosphere.

A very thin layer (∼20 Γ…) is present on the copper of the printed circuit board. This layer comprises carbon, oxygen and nitrogen. After vapour‐phase treatment at 220Β°C, the layer on the copper surface increases up to ∼100 Γ… and its composition changes: carbon decreases, oxygen appears more in the β€˜lattice form’ than as hydroxide and nitrogen is present in two valence states.


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