Surface investigation of copper in the p
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A. Manara; V. Sirtori
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Article
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1990
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John Wiley and Sons
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English
โ 297 KB
## Abstract The aim of the study was to determine both the oxidation rate of copper in the printed circuit board and the degradation of an organic compound (ENTEK) present on its surface during the different phases of circuit assembling. A large number of samples stripped from electronic cards hav