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Surface finishes of rolled copper foil for flexible printed circuit board

โœ Scribed by Chang-Yong Lee; Won-Chul Moon; Seung-Boo Jung


Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
861 KB
Volume
483-484
Category
Article
ISSN
0921-5093

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Surface investigation of copper in the p
โœ A. Manara; V. Sirtori ๐Ÿ“‚ Article ๐Ÿ“… 1990 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 297 KB

## Abstract The aim of the study was to determine both the oxidation rate of copper in the printed circuit board and the degradation of an organic compound (ENTEK) present on its surface during the different phases of circuit assembling. A large number of samples stripped from electronic cards hav