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An interactive and integrated thermal characterization of component placement on a printed circuit board

✍ Scribed by Jean-Louis Blanchard; Sophie Louage

Publisher: Elsevier Science
Year: 1997
Tongue: English
Weight: 642 KB
Volume: 28
Category: Article
ISSN: 0026-2692
DOI: 10.1016/s0026-2692(96)00025-0

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