✦ LIBER ✦

Life expectancies of Pb-free SAC solder interconnects in electronic hardware

✍ Scribed by Michael Osterman; Abhijit Dasgupta

Book ID: 106397497
Publisher: Springer US
Year: 2006
Tongue: English
Weight: 448 KB
Volume: 18
Category: Article
ISSN: 0957-4522
DOI: 10.1007/s10854-006-9017-3

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Nanoindentation study of Zn-based Pb fre

Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications

✍ K. Mohan Kumar; V. Kripesh; Lu Shen; Kaiyang Zeng; Andrew A.O. Tay 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 362 KB

Because of their hazardous nature, conventional Sn-Pb solders are slowly being replaced by Pb free solders. Sn-Zn solder alloys have been identified as a potential alternative because of their low melting point close to that of Sn-Pb solder. However, the high Sn content and reflow temperature will a

Issues related to the implementation of

✍ D. R. Frear 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 725 KB

SIMS microprofiles of Pb5%Sn solder joi

SIMS microprofiles of Pb5%Sn solder joints in electronic devices after accelerated life tests

✍ A. Scandurra; A. Porto; O. Puglisi 📂 Article 📅 1995 🏛 Elsevier Science 🌐 English ⚖ 886 KB

Development of materials design tool and

Development of materials design tool and its application in Pb-free micro-solders in electronic package

✍ XingJun Liu; CuiPing Wang; Ikuo Ohnuma; ShuangLin Chen; Ryosuke Kainuma; Kiyohit 📂 Article 📅 2010 🏛 SP Science China Press 🌐 English ⚖ 718 KB

SIMS microprofiles of Pb5%Sn solder joi

SIMS microprofiles of Pb5%Sn solder joints in electronic devices after accelerated life tests : Scandurra, A., Porto, A. and Puglisi, O. Appl. Surf. Sci. (1995) 89 (1), 1–10

📂 Article 📅 1996 🏛 Elsevier Science 🌐 English ⚖ 64 KB