Development of materials design tool and its application in Pb-free micro-solders in electronic package

✍ Scribed by XingJun Liu; CuiPing Wang; Ikuo Ohnuma; ShuangLin Chen; Ryosuke Kainuma; Kiyohito Ishida; Austin Y. Chang

• Book ID: 107356656
• Publisher: SP Science China Press
• Year: 2010
• Tongue: English
• Weight: 718 KB
• Volume: 53
• Category: Article
• ISSN: 1006-9321
• DOI: 10.1007/s11431-010-3199-x