This work combines plasma doping implantation (PLAD) with laser annealing using excimer laser, for the formation of ultra-shallow junctions. For that purpose, high dose BF 3 was implanted in n-type silicon wafers using PLAD. The as implanted material was investigated by high resolution TEM, measured
β¦ LIBER β¦
Laser-Annealed, Implanted Boron Emitters for B-BSF Silicon Solar Cells
β Scribed by B. Paviet-Salomon; J.F. Lerat; A. Lanterne; T. Emeraud; S. Gall; A. Slaoui
- Book ID
- 116427195
- Publisher
- Elsevier
- Year
- 2012
- Weight
- 439 KB
- Volume
- 27
- Category
- Article
- ISSN
- 1876-6102
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