Kirkendall Void Formation During Selective Oxidation
โ Scribed by Yong Feng Gong; Bruno C. De Cooman
- Book ID
- 107444163
- Publisher
- The Minerals, Metals & Materials Society
- Year
- 2010
- Tongue
- English
- Weight
- 396 KB
- Volume
- 41
- Category
- Article
- ISSN
- 1073-5623
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
Solder joints of Cu/Sn-3.5Ag were prepared using Cu foil or electroplated Cu films with or without SPS additive. With a high level of SPS in the Cu electroplating bath, voids tended to localize at the Cu/Cu 3 Sn interface during subsequent aging at 150 ยฐC, which was highly detrimental to the drop im
## Abstract For resin matrix composites, voids are common defects that can seriously deteriorate the properties of the composite parts. Thus, the elimination of voids is a crucial element in controlling the manufacturing process of composite parts. This article focuses on void formation originating