✦ LIBER ✦

Kinetics of interfacial reaction between eutectic Sn-Pb solder and Cu/Ni/Pd metallizations

✍ Scribed by G. Ghosh

Publisher: Springer US
Year: 1999
Tongue: English
Weight: 591 KB
Volume: 28
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-999-0163-2

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

A comparative study of the kinetics of i

A comparative study of the kinetics of interfacial reaction between eutectic solders and Cu/Ni/Pd metallization

✍ G. Ghosh 📂 Article 📅 2000 🏛 Springer US 🌐 English ⚖ 416 KB

Interfacial reactions between eutectic S

Interfacial reactions between eutectic Sn–Pb solder and Co substrate

✍ Chao-hong Wang; Chun-yi Kuo 📂 Article 📅 2010 🏛 Springer 🌐 English ⚖ 472 KB

Interfacial Reaction Between Eutectic Sn

Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During Reflow

✍ Hsiao-Yun Chen; Chih Chen 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 673 KB

Effect of volume in interfacial reaction

Effect of volume in interfacial reaction between eutectic Sn–Pb solder and Cu metallization in microelectronic packaging

✍ Ahmed Sharif; Y.C Chan; Rashed Adnan Islam 📂 Article 📅 2004 🏛 Elsevier Science 🌐 English ⚖ 391 KB

Eutectic Sn-Pb is historically the most important solder alloy, thus its reactions will serve as relevant references for Pb-free solder substitutes. Here, an investigation has been carried out to compare the dissolution kinetics of the Cu pad of the ball grid array (BGA) substrate with the molten co

Interfacial reaction between Au–Sn solde

Interfacial reaction between Au–Sn solder and Au/Ni-metallized Kovar

✍ Jeong-Won Yoon; Bo-In Noh; Seung-Boo Jung 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 784 KB

Interfacial Reactions Between Pb-Free So

Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates

✍ Yee-Wen Yen; Wei-Kai Liou; Hong-Yao Wei; Chiapyng Lee 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 615 KB