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Interfacial reaction between Au–Sn solder and Au/Ni-metallized Kovar

✍ Scribed by Jeong-Won Yoon; Bo-In Noh; Seung-Boo Jung

Publisher
Springer US
Year
2010
Tongue
English
Weight
784 KB
Volume
22
Category
Article
ISSN
0957-4522

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Dissolution and reaction both play important roles in the interaction between Au studs and PbSn solders. The kinetics of interfacial reaction in this system has been studied by measuring the rate of Au consumption and growth rate of the AuSn intermetallic compound (IMC) layer at temperatures from 19