Eutectic Sn-Pb is historically the most important solder alloy, thus its reactions will serve as relevant references for Pb-free solder substitutes. Here, an investigation has been carried out to compare the dissolution kinetics of the Cu pad of the ball grid array (BGA) substrate with the molten co
✦ LIBER ✦
Interfacial reactions between eutectic Sn–Pb solder and Co substrate
✍ Scribed by Chao-hong Wang; Chun-yi Kuo
- Publisher
- Springer
- Year
- 2010
- Tongue
- English
- Weight
- 472 KB
- Volume
- 46
- Category
- Article
- ISSN
- 0022-2461
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