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Junction formation and characteristics of CdS/CuInSe2/metal interfaces

โœ Scribed by S. Ashour; S. Alkuhaimi; H. Moutinho; R. Matson; F. Abou-Elfotouh


Publisher
Elsevier Science
Year
1993
Tongue
English
Weight
467 KB
Volume
226
Category
Article
ISSN
0040-6090

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Metal-polymer interfaces with different but well defined morphologies were prepared by evaporating noble metals (Au, Ag, Cu) onto chemically different polymers, i.e. bisphenol-trimethyl cyclohexane polycarbonate (TMC-PC), pyromellitic dianhydride-oxydianiline (PMDA-ODA) polyimide (PI), polystyrene (