✦ LIBER ✦

Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders

✍ Scribed by W.-M. Chen; P. McCloskey; S.C. O’Mathuna

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Effect of cooling rate on microstructure

✍ J. G. Maveety; P. Liu; J. Vijayen; F. Hua; E. A. Sanchez 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 846 KB

Shear strength and aging characteristics

✍ Jin-Won Choi; Ho-Seob Cha; Tae-Sung Oh 📂 Article 📅 2003 🏛 TechnoPress 🌐 English ⚖ 683 KB

Investigation on impact strength of the

✍ Ning Zhang; Yaowu Shi; Zhidong Xia; Yongping Lei; Fu Guo; Xiaoyan Li 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 640 KB

Metallurgical reaction of the Sn-3.5Ag s

✍ Chien-Sheng Huang; Jenq-Gong Duh; Yen-Ming Chen 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 152 KB

Isothermal aging of near-eutectic Sn-Ag-

✍ B. A. Cook; I. E. Anderson; J. L. Harringa; S. K. Kang 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 250 KB

Effect of Interfacial Reaction on the Te

✍ Z. Chen; M. He; A. Kumar; G.J. Qi 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 753 KB