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Investigation of the role of compositional effects on electromigration damage of metallic interconnects

✍ Scribed by C Pennetta; L Reggiani; Gy Trefán; F Fantini; A Scorzoni; I De Munari


Book ID
117626581
Publisher
Elsevier Science
Year
2001
Tongue
English
Weight
112 KB
Volume
22
Category
Article
ISSN
0927-0256

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