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On the propensity of electromigration void growth from preexisting stress-voids in metal interconnects

✍ Scribed by C.A. Minor; Y.L. Guo; Y.-L. Shen


Book ID
114388905
Publisher
Elsevier Science
Year
1999
Tongue
English
Weight
159 KB
Volume
41
Category
Article
ISSN
1359-6462

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