๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Investigation of the Reliability of Copper Ball Bonds to Aluminum Electrodes

โœ Scribed by Jin Onuki; Koizumi, M.; Araki, I.

Book ID
117911699
Publisher
IEEE
Year
1987
Tongue
English
Weight
869 KB
Volume
10
Category
Article
ISSN
0148-6411

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

Direct bonding of copper to aluminum nit
Direct bonding of copper to aluminum nitride
โœ M. Entezarian; R.A.L. Drew ๐Ÿ“‚ Article ๐Ÿ“… 1996 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 919 KB

Direct bonding (DB) of copper to aluminum nitride was studied. The process parameters of DB were optimized based on time, temperature and thickness of the Cu-foil for Cu-A&O, system in an N, atmosphere containing 500 ppm 0, in a temperature range of 1065 to 1075 "C. These conditions were then applie