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Study of factors affecting the hardness of ball bonds in copper wire bonding

✍ Scribed by Z.W. Zhong; H.M. Ho; Y.C. Tan; W.C. Tan; H.M. Goh; B.H. Toh; J. Tan


Publisher
Elsevier Science
Year
2007
Tongue
English
Weight
518 KB
Volume
84
Category
Article
ISSN
0167-9317

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