✦ LIBER ✦
Fundamentals of thermo-sonic copper wire bonding in microelectronics packaging
✍ Scribed by S. Murali; N. Srikanth; Y. M. Wong; Charles J. Vath
- Publisher
- Springer
- Year
- 2006
- Tongue
- English
- Weight
- 391 KB
- Volume
- 42
- Category
- Article
- ISSN
- 0022-2461
No coin nor oath required. For personal study only.