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Investigation of stress exponent in the room-temperature creep of Sn–40Pb–2.5Sb solder alloy

✍ Scribed by R. Mahmudi; A. Rezaee-Bazzaz; H.R. Banaie-Fard

Book ID: 116600601
Publisher: Elsevier Science
Year: 2007
Tongue: English
Weight: 764 KB
Volume: 429
Category: Article
ISSN: 0925-8388
DOI: 10.1016/j.jallcom.2006.04.037

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