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Investigation of model parameters of lead-containing and lead-free solders

✍ Scribed by V.S. Nguyen; K.P. Herrmann; W.H. Müller

Publisher
John Wiley and Sons
Year
2002
Weight
123 KB
Volume
1
Category
Article
ISSN
1617-7061

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At present, the electronic packaging industry is actively searching for lead‐free (Pb‐free) solders due to environmental concerns over Pb‐containing solders. For a successful transition to Pb‐free manufacturing in electronics assembly, it is critical to understand the behavior of Pb‐free solders. We