𝔖 Bobbio Scriptorium

✦ LIBER ✦

Internal lead fatigue through thermal expansion in semiconductor devices

✍ Scribed by Gaffney, J.

Book ID: 114589415
Publisher: IEEE
Year: 1968
Tongue: English
Weight: 145 KB
Volume: 15
Category: Article
ISSN: 0018-9383
DOI: 10.1109/t-ed.1968.16412

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Modelling of thermal fatigue failure in

Modelling of thermal fatigue failure in soft-soldered semiconductor devices using the internal variable method

✍ A. Chen; X. Gui; G.-B. Gao 📂 Article 📅 1990 🏛 Elsevier Science 🌐 English ⚖ 303 KB

[IEEE 2012 24th International Symposium

[IEEE 2012 24th International Symposium on Power Semiconductor Devices & IC's (ISPSD) - Bruges, Belgium (2012.06.3-2012.06.7)] 2012 24th International Symposium on Power Semiconductor Devices and ICs - Investigation of voltage-dependent thermal property in high-voltage drain-extended MOSFETs

✍ Chu, Chen-Liang; Hu, C.M.; Huang, C.F.; Chen, Y.S.; Chen, F.Y.; Thei, K.B.; Hsu, 📂 Article 📅 2012 🏛 IEEE ⚖ 893 KB

[IEEE 1993 IEEE International Symposium

[IEEE 1993 IEEE International Symposium on Circuits and Systems - Chicago, IL, USA (3-6 May 1993)] 1993 IEEE International Symposium on Circuits and Systems - Thermal failure simulation for electrical overstress in semiconductor devices

✍ Diaz, C.; Duvvury, C.; Kang, S.-M. 📂 Article 📅 1993 🏛 IEEE ⚖ 392 KB