✦ LIBER ✦
Modelling of thermal fatigue failure in soft-soldered semiconductor devices using the internal variable method
✍ Scribed by A. Chen; X. Gui; G.-B. Gao
- Publisher
- Elsevier Science
- Year
- 1990
- Tongue
- English
- Weight
- 303 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0026-2714
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