✦ LIBER ✦

Intermetallic growth study on SnAgCu/Cu solder joint interface during thermal aging

✍ Scribed by H. Xiao, X. Y. Li, Y. X. Zhu, J. L. Yang…

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Growth mechanisms of interfacial interme

✍ Yu, Chi-Yang; Duh, Jenq-Gong 📂 Article 📅 2012 🏛 Springer 🌐 English ⚖ 942 KB

Suppressing the growth of interfacial Cu

✍ Wei-Yu Chen; Chi-Yang Yu; Jenq-Gong Duh 📂 Article 📅 2012 🏛 Springer 🌐 English ⚖ 798 KB

Influence of Dopant on Growth of Interme

✍ G. Y. Li; X. D. Bi; Q. Chen; X. Q. Shi 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 908 KB

Effect of Ni on growing of intermetallic

✍ Zhang, K K; Li, C Y; Qiu, R F; Shi, H X; Wang, Y L 📂 Article 📅 2012 🏛 Institute of Materials, Minerals and Mining 🌐 English ⚖ 325 KB

Influence of initial morphology and thic

✍ X. Deng; G. Piotrowski; J. J. Williams; N. Chawla 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 247 KB

Effect of Bi Segregation on the Asymmetr

✍ Xiaowu Hu,Yulong Li,Ke Li,Zhixian Min 📂 Article 📅 2013 🏛 Springer US 🌐 English ⚖ 738 KB