Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

✍ Scribed by Zhang, K K; Li, C Y; Qiu, R F; Shi, H X; Wang, Y L

• Book ID: 126223493
• Publisher: Institute of Materials, Minerals and Mining
• Year: 2012
• Tongue: English
• Weight: 325 KB
• Volume: 28
• Category: Article
• ISSN: 0267-0836
• DOI: 10.1179/1743284711Y.0000000131