✦ LIBER ✦

Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3and Cu/Ti/Si with Sn/In interlayer

✍ Scribed by Tung-Han Chuang; Hsiu-Jen Lin; Cheng-Wen Tsao

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Thin-film reactions during diffusion sol

✍ M. W. Liang; T. E. Hsieh; S. Y. Chang; T. H. Chuang 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 216 KB

The morphology and kinetic evolution of

✍ S. Y. Chang; L. C. Tsao; M. W. Wu; C. W. Chen 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 960 KB

Intermetallic compounds formed during th

✍ M. D. Cheng; S. Y. Chang; S. F. Yen; T. H. Chuang 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 810 KB

Intermetallic compounds formed during th

✍ M. D. Cheng; S. Y. Chang; S. F. Yen; T. H. Chuang 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 42 KB