✦ LIBER ✦

Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps

✍ Scribed by Myeong-Hyeok Jeong; Gi-Tae Lim; Byoung-Joon Kim; Ki-Wook Lee; Jae-Dong Kim; Young-Chang Joo; Young-Bae Park

No coin nor oath required. For personal study only.

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