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Effect of Ti on the interfacial reaction between Sn and Cu

โœ Scribed by V. Vuorinen; H. Q. Dong; T. Laurila

Publisher
Springer US
Year
2011
Tongue
English
Weight
546 KB
Volume
23
Category
Article
ISSN
0957-4522

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Effect of volume in interfacial reaction
Effect of volume in interfacial reaction between eutectic Snโ€“Pb solder and Cu metallization in microelectronic packaging
โœ Ahmed Sharif; Y.C Chan; Rashed Adnan Islam ๐Ÿ“‚ Article ๐Ÿ“… 2004 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 391 KB

Eutectic Sn-Pb is historically the most important solder alloy, thus its reactions will serve as relevant references for Pb-free solder substitutes. Here, an investigation has been carried out to compare the dissolution kinetics of the Cu pad of the ball grid array (BGA) substrate with the molten co