✦ LIBER ✦

Interfacial reaction and dissolution behavior of Cu substrate in molten Sn-3.8Ag-0.7Cu in the presence of Mo nanoparticles

✍ Scribed by Arafat, M.M.; Haseeb, A.S.M.A.; Johan, Mohd Rafie

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Effects of reflow on the interfacial cha

✍ Chan, Y.H.; Arafat, M.M.; Haseeb, A.S.M.A. 📂 Article 📅 2013 🏛 Emerald Group Publishing Limited 🌐 English ⚖ 485 KB

Comparison of spreading behaviour and in

✍ Narayan, S; Prabhu, K N 📂 Article 📅 2013 🏛 Institute of Materials, Minerals and Mining 🌐 English ⚖ 723 KB

Intermetallic compounds formed during th

✍ M. D. Cheng; S. Y. Chang; S. F. Yen; T. H. Chuang 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 42 KB

Effects of Co nanoparticle addition to S

✍ A.S.M.A. Haseeb; Tay See Leng 📂 Article 📅 2011 🏛 Elsevier Science 🌐 English ⚖ 477 KB

Effect of Cu diffusion through Ni on the

✍ H.T. Chen; C.Q. Wang; M.Y. Li; D.W. Tian 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 584 KB

Influence of Ni nanoparticle on the morp

✍ S.L. Tay; A.S.M.A. Haseeb; Mohd Rafie Johan; P.R. Munroe; M.Z. Quadir 📂 Article 📅 2013 🏛 Elsevier Science 🌐 English ⚖ 689 KB