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Effects of Co nanoparticle addition to Sn–3.8Ag–0.7Cu solder on interfacial structure after reflow and ageing

✍ Scribed by A.S.M.A. Haseeb; Tay See Leng


Book ID
116574959
Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
477 KB
Volume
19
Category
Article
ISSN
0966-9795

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