Effects of Co nanoparticle addition to Sn–3.8Ag–0.7Cu solder on interfacial structure after reflow and ageing

✍ Scribed by A.S.M.A. Haseeb; Tay See Leng

• Book ID: 116574959
• Publisher: Elsevier Science
• Year: 2011
• Tongue: English
• Weight: 477 KB
• Volume: 19
• Category: Article
• ISSN: 0966-9795
• DOI: 10.1016/j.intermet.2011.01.009