๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Interface structure between polyimide film substrate and copper film prepared by ion beam and vapor deposition (IVD) method

โœ Scribed by Akinori Ebe; Eiji Takahashi; Naoto Kuratani; Satoshi Nishiyama; Osamu Imai; Kiyoshi Ogata; Yuichi Setsuhara; Shoji Miyake


Book ID
114168597
Publisher
Elsevier Science
Year
1997
Tongue
English
Weight
431 KB
Volume
121
Category
Article
ISSN
0168-583X

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES


Enhancing adhesion by ion beam-induced a
โœ S. K. Koh; K. D. Pae; N. G. Stoffel; D. L. Hart ๐Ÿ“‚ Article ๐Ÿ“… 1990 ๐Ÿ› Society for Plastic Engineers ๐ŸŒ English โš– 462 KB

## Abstract Ion beam mixing was used to improve the adhesion between deposited Cu film (400 ร…) and polyimide (PI) substrate. Ar^+^ ion with the energy levels between 180 and 200 keV, and the dose between 10^14^ to 4 ร— 10^16^ ions/cm^2^ were used. The surface analyses were carried out by Rutherford