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Improvement of the adhesion to polyimide substrates of copper films prepared by an ion beam and vapor deposition (IVD) method

✍ Scribed by Akinori Ebe; Eiji Takahashi; Yasushi Iwamoto; Naoto Kuratani; Satoshi Nishiyama; Osamu Imai; Kiyoshi Ogata; Yuichi Setsuhara; Shoji Miyake

Book ID: 118367513
Publisher: Elsevier Science
Year: 1996
Tongue: English
Weight: 499 KB
Volume: 281-282
Category: Article
ISSN: 0040-6090
DOI: 10.1016/0040-6090(96)08629-4

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