Interface diffusion in eutectic Pb–Sn solder

✍ Scribed by D. Gupta; K. Vieregge; W. Gust

• Book ID: 104403748
• Publisher: Elsevier Science
• Year: 1998
• Tongue: English
• Weight: 491 KB
• Volume: 47
• Category: Article
• ISSN: 1359-6454
• DOI: 10.1016/s1359-6454(98)00348-6

✦ Synopsis

AbstractÐInterface diusion of 210 Pb and 113 Sn radioactive tracers in oriented Pb±62 wt% Sn eutectic specimens showing lamellar structure has been measured. The product of the interface diusion coecient and the width, dD i , shows an Arrhenius relationship below 400 K. The values of the Arrhenius parameters, Q i and dD8 i , for the 210 Pb and 113 Sn tracers are 84.8 kJ/mol, 7 Â 10 À10 m 3 /s and 77 kJ/mol, 7 Â 10 À12 m 3 /s, respectively. An interface energy of 150 mJ/m 2 has been computed from the diusion measurements. Above 400 K, the values of dD i deviate from the Arrhenius relationship and rise steeply so that they ®nally merge with the diusion data in grain boundaries in polycrystalline Pb and Pb±Sn alloys measured earlier. These eects are concomitant with the changes in the microstructure upon annealing where the Pb and Sn phases separate to form equiaxed grains. The importance of diusion in nearly coherent Pb±Sn interfaces in its plastic deformation processes is discussed.