Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering

✍ Scribed by Jong-Hyun Lee; Daejin Park; Jong-Tae Moon; Yong-Ho Lee; Dong-Hyuk Shin; Yong-Seog Kim

• Book ID: 107452364
• Publisher: Springer US
• Year: 2000
• Tongue: English
• Weight: 480 KB
• Volume: 29
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-000-0006-7