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Interdiffusion of thin bilayers of copper and nickel

✍ Scribed by Ilkka Suni; Marc-A. Nicolet; Martti Mäenpää

Publisher
Elsevier Science
Year
1981
Tongue
English
Weight
229 KB
Volume
79
Category
Article
ISSN
0040-6090

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## Experiments are reported on the chemical diffusion coefficients in the copper-nickel system for the two pure metals and also with the presence of thin (0.00002 in.) intermediate layers of Au, Sn, Zn or Cd. Au or Zn has small effect whilst Sn or Cd accelerate the rate of diffusion. Sn appears to