✦ LIBER ✦

Interconnect thermal modeling for accurate simulation of circuit timing and reliability

✍ Scribed by Danqing Chen; Erhong Li; Rosenbaum, E.; Sung-Mo Kang

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Circuit reliability simulator for interc

✍ Liew, B.-K.; Fang, P.; Cheung, N.W.; Hu, C. 📂 Article 📅 1992 🏛 IEEE 🌐 English ⚖ 823 KB

Compact Modeling and Simulation of Circu

✍ Wenping Wang, ; Reddy, V.; Krishnan, A.T.; Vattikonda, R.; Krishnan, S.; Yu Cao, 📂 Article 📅 2007 🏛 IEEE 🌐 English ⚖ 370 KB

Compact modeling approach using genetic

✍ Koji Koyamada; Yasuharu Yamada; Toshihiko Nishio; Hidetoshi Kotera 📂 Article 📅 2000 🏛 John Wiley and Sons 🌐 English ⚖ 193 KB

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✍ Z. LV; L. Milor; S. Yang 📂 Article 📅 2012 🏛 Elsevier Science 🌐 English ⚖ 784 KB

A novel lossy and dispersive interconnec

✍ Yuan, J.-S.; Eisenstadt, W.R.; Liou, J.J. 📂 Article 📅 1990 🏛 IEEE 🌐 English ⚖ 469 KB

Balanced truncated models of RC intercon

✍ Baoguo Yuan; Ben Wang; Shengguo Wang 📂 Article 📅 2005 🏛 SP Science Press 🌐 English ⚖ 310 KB