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Interconnect technologies for multi-chip modules: high frequency characterization and loss analysis

✍ Scribed by Joris Peeters; Eric Beyne; Gerold Brändli

Publisher: Elsevier Science
Year: 1992
Tongue: English
Weight: 265 KB
Volume: 19
Category: Article
ISSN: 0167-9317
DOI: 10.1016/0167-9317(92)90497-f

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