Interconnect Technologies for Integrated Circuits and Flexible Electronics (Springer Tracts in Electrical and Electronics Engineering)

✍ Scribed by Yash Agrawal (editor), Kavicharan Mummaneni (editor), P. Uma Sathyakam (editor)

• Publisher: Springer
• Year: 2023
• Tongue: English
• Leaves: 286
• Category: Library

✦ Synopsis

This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.

✦ Table of Contents

Preface
Contents
About the Editors
1 An Efficient Model Order Reduction of Interconnects Using Machine Learning for Timing Analysis
Introduction
Proposed Model Order Reduction
Denominator Reduction
Algorithm
Numerator Reduction
Results and Discussions
Conclusion
References
2 Delay and Overshoot Modelling of Asymmetric T-Tree Interconnects
Introduction
Proposed Model
Analysis of 1:2 Asymmetric T-Tree InterConnect
The Gaver-Stehfest Algorithm
Simulation and Results
1:2 Asymmetrical T-Tree Interconnect
Conclusion
References
3 Explicit Power-Delay Models for On-Chip Copper and SWCNT Bundle Interconnects
Introduction
Model Formulation
Results and Discussion
Conclusion
References
4 Modelling and Analysis of Copper and Carbon Nanotube VLSI Interconnects
Introduction
Analysis of Cu and CNT Interconnects
Results and Calculations
Conclusion
References
5 Repeater Insertion for Carbon Nanotube Interconnects
Introduction
Repeater Insertion in CNT Interconnects
Influence of Inductance on the Repeater Insertion in MWCNT Interconnects
Repeater Design in CNT Interconnects to Reduce Delay and Power
Conclusion
References
6 Through Silicon Vias for 3D Integration—A Mini Review
Introduction to 3D IC
Challenges in 3D Integration
Testing of IC and Its Yield
Heat Removal
Reliability
Power Distribution Networks
Placement of Chips and Vias
Clock Distribution Network
Signal Integrity
Via Reliability
Via Fabrication Process and Technologies
Via Fabrication Steps
TSV Process Technologies
Progress in 3D ICs
Literature Survey on Via Modeling
Electrical Modeling of Vias
Numerical Techniques
Summary
References
7 Neural Networks for Fast Design Space Exploration of On-Chip Interconnect Networks
Introduction
ANNs for Interconnect Modeling
KBNNs for Hybrid Cu-Graphene Interlink Networks
Numerical Example
Summary
References
8 A Comprehensive Analysis of Emerging Variants of Swarm Intelligence for Circuits and Systems
Introduction
Particle Swarm Optimization
Recent Advances in Particle Swarm Optimization
Linear Decreasing Inertia Weight PSO
Chaos Enhanced PSO
Adaptive Inertia Weight PSO
Gaussian Quantum Behaved PSO
Case Studies
Results and Comparative Analysis
Conclusion
References
9 PAM3: History, Algorithm, and Performance Comparison to NRZ and PAM4
Introduction
The Encoding Schemes and Test Sequences of PAM3
3B2T Versus 11B7T
PRBS Versus PRTS
Scrambling and Pre-coding
Performance Analysis: In Comparison to NRZ and PAM4
Reflection Coefficient
Loss
Crosstalk
Mode Conversion
Noise
Summary
References
10 Emerging Interconnect Technologies for Integrated Circuits and Flexible Electronics
Introduction
Package Technology
Combining Multiple Technologies—Chiplets
Die Stacking
Printed Circuit Board Technology
Trend in Data Rate of High-Speed Interfaces
High-Speed SerDes Channel Topologies
High-Speed Memory Channel Topologies
Printed/Flexible Electronics
Summary
References
11 Contact and Interconnect Considerations for Organic and Flexible Electronics
Introduction
Organic and Flexible Electronics: Historical Developments
Flexible Electronics: Advantages and Potential Applications
Flexible Organic TFTs
Device Structure and Operation
Operation and Parameter Extraction
Device Performance Parameters
Contact Resistance
Contact Resistance Extraction
Approaches to Reduce Contact Resistance
Flexible and Stretchable Interconnects
Toward Green and Biodegradable Electronics
Summary
References
12 Stretchable Interconnects: Materials, Geometry, Fabrication, and Applications
Introduction
Substrate Materials
Geometry of Stretchable Interconnect Structures
Mesh Geometry
Spiral Geometry
Meander Geometry
Horseshoe Geometry
Fabrication Techniques
Microfabrication
Transfer Printing Technology
Contact Printing
Spray Coating Technology
Inkjet Printing Technology
Screen Printing Technology
Applications of Stretchable Interconnects
Conclusion
References
13 Flexible Electronics: A Critical Review
Introduction
Components of Flexible Electronics
Substrate
Device
Interconnect
Encapsulation
Printing Technologies for Fabrication of FE
Market Growth and Applications
Market Growth
Applications
Conclusion
References
14 Delay Analysis of Different Stretchable Interconnect Structures
Introduction
Modeling Methodology of Stretchable Interconnects
Exploration of Stretchable Interconnects
Equivalent Circuit
Delay Calculation
Results and Discussion
Conclusions
References
15 Flexible Sensors for Plant Disease Monitoring
Introduction
Flexible Humidity Sensors
Sensor Fabrication and Experimental Set-Up
Sensor Transfers Function
Flexible Temperature Sensors
Sensor Fabrication and Experimental Set-Up
Sensor Transfers Function
Flexible Leaf Wetness Sensors
Sensor Fabrication and Experimental Set-Up
Sensor Transfers Function
Conclusion
References
16 GaitTracker: A Digital Platform for Measuring, Detecting and Analyzing Gait Changes
Introduction
Related Work
Methodology
Data Collection
Measurement Platform
Data Processing
Detection of Gait Changes
Conclusions
References