๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints

โœ Scribed by Yanghua Xia; Chuanyan Lu; Junling Chang; Xiaoming Xie

Book ID
110627040
Publisher
Springer US
Year
2006
Tongue
English
Weight
487 KB
Volume
35
Category
Article
ISSN
0361-5235

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

Polarity effect of electromigration on i
Polarity effect of electromigration on intermetallic compound formation in SnPb solder joints
โœ Yu-Dong Lu; Xiao-Qi He; Yun-Fei En; Xin Wang; Zhi-Qiang Zhuang ๐Ÿ“‚ Article ๐Ÿ“… 2009 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 695 KB

The polarity effect of electromigration on the interfacial reactions of micro ball grid array (lBGA) solder joints was studied in terms of microstructural evolution. A dummy lBGA package with the same pair of solder joints was used to obtain reproducible results for a practical application. The lBGA