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Interaction integrals for thermal fracture of functionally graded piezoelectric materials

✍ Scribed by B.N. Rao; M. Kuna

Publisher
Elsevier Science
Year
2010
Tongue
English
Weight
464 KB
Volume
77
Category
Article
ISSN
0013-7944

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✦ Synopsis

This paper presents domain form of the interaction integrals based on three independent formulations for computation of the stress intensity factors and electric displacement intensity factor for cracks in functionally graded piezoelectric materials subjected to steady-state thermal loading. Each of the formulation differs in the way auxiliary fields are imposed in the evaluation of interaction integral and each of them results in a consistent form of the interaction integral in the sense that extra terms naturally appear in their derivation to compensate for the difference in the chosen crack tip asymptotic fields of homogeneous and functionally graded piezoelectric medium.

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Interaction integrals for thermal fractu
Interaction integrals for thermal fracture of functionally graded materials
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This paper addresses finite element evaluation of the non-singular T-stress and mixed-mode stress intensity factors in functionally graded materials (FGMs) under steady-state thermal loads by means of interaction integral. Interaction integral provides an accurate and efficient numerical framework i

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Erratum to β€œInteraction integrals for fracture analysis of functionally graded piezoelectric materials”, International Journal of Solids and Structures 45 (20) (2008) 5237–5257
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