This paper addresses finite element evaluation of the non-singular T-stress and mixed-mode stress intensity factors in functionally graded materials (FGMs) under steady-state thermal loads by means of interaction integral. Interaction integral provides an accurate and efficient numerical framework i
Computation of thermal fracture parameters for orthotropic functionally graded materials using Jk-integral
β Scribed by Serkan Dag; E. Erhan Arman; Bora Yildirim
- Publisher
- Elsevier Science
- Year
- 2010
- Tongue
- English
- Weight
- 841 KB
- Volume
- 47
- Category
- Article
- ISSN
- 0020-7683
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β¦ Synopsis
This article introduces a computational method based on the J k -integral for mixed-mode fracture analysis of orthotropic functionally graded materials (FGMs) that are subjected to thermal stresses. The generalized definition of the J k -integral is recast into a domain independent form composed of line and area integrals by utilizing the constitutive relations of plane orthotropic thermoelasticity. Implementation of the domain independent J k -integral is realized through a numerical procedure developed by means of the finite element method. The outlined computational approach enables the evaluation of the modes I and II stress intensity factors, the energy release rate, and the T-stress. The developed technique is validated numerically by considering two different problems, the first of which is the problem of an embedded crack in an orthotropic FGM layer subjected to steady-state thermal stresses; and the second one is that of periodic cracks under transient thermal loading. Comparisons of the mixed-mode stress intensity factors evaluated by the J k -integral based method to those calculated through the displacement correlation technique (DCT) and to those available in the literature point out that, the proposed form of the J kintegral possesses the required domain independence and leads to numerical results of high accuracy. Further results are presented to illustrate the influences of the geometric and material constants on the thermal fracture parameters.
π SIMILAR VOLUMES
This paper presents domain form of the interaction integrals based on three independent formulations for computation of the stress intensity factors and electric displacement intensity factor for cracks in functionally graded piezoelectric materials subjected to steady-state thermal loading. Each of
The authors regret that unfortunately errors cropped up in Section 4.2.4 of in our paper ''Interaction integrals for fracture analysis of functionally graded piezoelectric materials", International Journal of Solids and Structures 45 (20