This paper presents domain form of the interaction integrals based on three independent formulations for computation of the stress intensity factors and electric displacement intensity factor for cracks in functionally graded piezoelectric materials subjected to steady-state thermal loading. Each of
Interaction integrals for thermal fracture of functionally graded materials
β Scribed by Amit KC; Jeong-Ho Kim
- Publisher
- Elsevier Science
- Year
- 2008
- Tongue
- English
- Weight
- 364 KB
- Volume
- 75
- Category
- Article
- ISSN
- 0013-7944
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β¦ Synopsis
This paper addresses finite element evaluation of the non-singular T-stress and mixed-mode stress intensity factors in functionally graded materials (FGMs) under steady-state thermal loads by means of interaction integral. Interaction integral provides an accurate and efficient numerical framework in evaluating these fracture parameters in FGMs under thermal as well as mechanical loads. We use a non-equilibrium formulation and the corresponding auxiliary (secondary) fields tailored for FGMs. Graded finite elements have been developed to account for the spatial gradation of thermomechanical properties. This paper presents various numerical examples in which the accuracy of the present method is verified.
π SIMILAR VOLUMES
This article introduces a computational method based on the J k -integral for mixed-mode fracture analysis of orthotropic functionally graded materials (FGMs) that are subjected to thermal stresses. The generalized definition of the J k -integral is recast into a domain independent form composed of
In this paper, the viscoelastic fracture of multiple cracks in a functionally graded strip is studied. The solution of linear elastic crack tip field is investigated at first, using the finite element method. Both applied stress load and applied strain load are taken into account. The effects of the
Thermal fatigue resistance is one of the most important characteristics of the materials subjected to rapid temperature changes, i.e., high-pressure die casting, hot forging. Therefore the aim of the present study was to determine the suitability of using the functionally graded materials (FGM) in a
The authors regret that unfortunately errors cropped up in Section 4.2.4 of in our paper ''Interaction integrals for fracture analysis of functionally graded piezoelectric materials", International Journal of Solids and Structures 45 (20