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Inlay repair of a broken solder joint

โœ Scribed by T. Milton Skeeters; Hugh N. Burkett; Thomas R. Mee


Book ID
118923519
Publisher
Elsevier Science
Year
1986
Tongue
English
Weight
974 KB
Volume
56
Category
Article
ISSN
1097-6841

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โœ De-Shin Liu; Chin-Yu Ni ๐Ÿ“‚ Article ๐Ÿ“… 2002 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 722 KB

A BGA package warping produced hybrid deformations in the solder joint interconnections. This situation creates difficult challenges in avoiding certain mechanical failure problems and even maintaining acceptable electrical performance in the electronic package. Accessing electronic circuit simulati