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Influences of interface oxidation on transmission laser bonding of wafers for microsystem packaging

✍ Scribed by Ampere A. Tseng; Jong-Seung Park; George P. Vakanas; Hongtao Wu; Miroslav Raudensky; T. P. Chen

Book ID: 106185152
Publisher: Springer-Verlag
Year: 2006
Tongue: English
Weight: 457 KB
Volume: 13
Category: Article
ISSN: 0946-7076
DOI: 10.1007/s00542-006-0249-1

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## Abstract The study evaluated the __in vitro__ influence of pulse‐repetition rate of Er:YAG laser and dentin depth on tensile bond strength of dentin–resin interface. Dentin surfaces of buccal or lingual surfaces from human third molars were submitted to tensile test in different depths (superfic