✦ LIBER ✦
Electric feed-through for vacuum package using double-side anodic bonding of silicon-on-insulator wafer
✍ Scribed by Chu, Hoang Manh; Vu, Hung Ngoc; Hane, Kazuhiro
- Book ID
- 121363025
- Publisher
- Elsevier Science
- Year
- 2013
- Tongue
- French
- Weight
- 823 KB
- Volume
- 71
- Category
- Article
- ISSN
- 0304-3886
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