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Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints

✍ Scribed by G. MAHENDRAN; V. BALASUBRAMANIAN; T. SENTHILVELAN

Book ID
117694012
Publisher
Elsevier Science
Year
2010
Tongue
English
Weight
799 KB
Volume
20
Category
Article
ISSN
1003-6326

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