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Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

✍ Scribed by Yamakawa, Tomohiro; Takemoto, Tadashi; Shimoda, Masayoshi; Nishikawa, Hiroshi; Shiokawa, Kunio; Terada, Nobuto

Book ID: 120486397
Publisher: Springer US
Year: 2013
Tongue: English
Weight: 873 KB
Volume: 42
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-013-2583-2

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