Effects of processing parameters on the bond strength of Cu/Cu roll-bonded strips

✍ Scribed by Mohsen Abbasi; Mohammad Reza Toroghinejad

• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 512 KB
• Volume: 210
• Category: Article
• ISSN: 0924-0136
• DOI: 10.1016/j.jmatprotec.2009.11.003

✦ Synopsis

Roll bonding, widely used in manufacturing large layered composite sheets, is a solid phase method for bonding similar or dissimilar metals by rolling. In this study, the effects of process parameters such as rolling reduction, rolling temperature, rolling speed, initial thickness of strip, and surface roughness on the bond strength between two-layer strips of Cu/Cu were investigated. The strips were subjected to chemical and mechanical cleaning prior to rolling, and after rolling, bond strengths were measured using the peeling test. It was observed that increased reduction, rolling temperature, strip width, and surface roughness led to an increase in peeling strength while increased rolling speed and initial thickness of strips caused peeling strength to decrease. Results also showed that increasing the initial thickness of strips would increase threshold deformation.