Influence of tartaric acid on the electrodeposition of silver from aqueous AgNO3solutions
β Scribed by G. Papanastasiou; D. Jannakoudakis; J. Amblard; M. Froment
- Publisher
- Springer
- Year
- 1985
- Tongue
- English
- Weight
- 873 KB
- Volume
- 15
- Category
- Article
- ISSN
- 0021-891X
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π SIMILAR VOLUMES
The effects of thiourea on the mechanism of the Cu/Ct?+ system were studied using Pt/Pt and Cu/Pt rotating ring disc electrodes in a 0.7 M CuS04-1.8 M H,SO, solution. Thiourea at low concentrations inhibits the reduction of the intermediate Cu+ to Cu on a copper surface. Thus more Cu+ escapes from t
found iicccssnry to placo n piccc of pnpcr bctwccn tho poles of tho inngnct and tho strip of iron, M, in ordcr to prcvcnt tho lnttcr being still nttrirctcd by tho magnet nftcr thc nlegnctising current hwl bccn broken. A rubbcr tubo nttnchcd to tho lower oittlct, B, of tlic upper chamber, I, of thc