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Influence of process parameters on the substrate heating in direct current plasma magnetron sputtering deposition process

✍ Scribed by Krishnasamy, Jegenathan; Chan, Kah-Yoong; Tou, Teck-Yong


Book ID
115492133
Publisher
Emerald Group Publishing Limited
Year
2010
Tongue
English
Weight
132 KB
Volume
27
Category
Article
ISSN
1356-5362

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This paper discusses the influence of direct current (DC) power in the magnetron sputtering process on the crystallite size of the copper (Cu) thin films deposited on p-type silicon substrate at room temperature. X-ray diffraction (XRD) and Karl Suss four-point probe were employed to study the film